FIELD: process engineering.
SUBSTANCE: proposed method consists in that pulsed laser beam is directed to processed material to cause destruction in focusing points. Note that pulsed laser radiation is used with wavelength in or out of transparency range of processed material. Sequential removal of material is performed by focusing laser beam on processed material surface. Note here that sequential material layer removal is performed by producing group of hollows with variable coefficient of overlapping between separate layers in the range of 0.1 to 0.9. Then sequential step-by-step removal of next layer is performed, also with variable coefficient of overlapping between separate layers in the range of 0.2 to 0.95. In using pulsed laser radiation with wavelength in transparency range of processed material, sequential step-by-step material removal is performed by focusing laser beam at processed material inlet or outlet surface with respect to laser beam propagation direction.
EFFECT: expanded performances due to step-by-step removal of material from processed product surface.
2 cl, 12 dwg, 10 ex
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Authors
Dates
2010-07-20—Published
2009-04-13—Filed