FIELD: metallurgy.
SUBSTANCE: invention relates to methods of cutting of fragile nonmetallic materials, particularly, of sapphire plates, by pulse laser light with a wave length of 1064 nanometers. Invention can be used in various engineering fields and technologies for wasteless and high-precision cutting (thermal splitting) of sapphire plates. Method of controlled laser thermal splitting of sapphire plates includes directing of a laser beam from a pulse solid-state Nd: YAG laser onto the surface of a sapphire plate. Beforehand, energy absorbing graphite layers are deposited on both sides of a sapphire plate in the direction of cutting, then the cutting line is heated with laser radiation with a pulse duration of 50-100 ns and average power of 80-100 W, and a separating through crack is formed in the material.
EFFECT: invention is aimed at solving the task of increasing efficiency and quality of cutting.
1 cl, 3 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD OF CUTTING PLATES FROM FRAGILE MATERIALS | 2009 |
|
RU2404931C1 |
| METHOD OF CUTTING FRAGILE NONMETALLIC MATERIALS | 2012 |
|
RU2494051C1 |
| METHOD FOR CUTTING OF TRANSPARENT NON-METAL MATERIALS | 2002 |
|
RU2226183C2 |
| METHOD OF OBTAINING SENSITIVE MATERIAL FOR A GAS SENSOR ON A SAPPHIRE SUBSTRATE | 2016 |
|
RU2625096C1 |
| PROCESS OF CUTTING OF NONMETAL MATERIALS | 1992 |
|
RU2024441C1 |
| METHOD OF BRITTLE NONMETALIE MATERIALS CUTTING (VERSIONS) | 2007 |
|
RU2333163C1 |
| METHOD OF CRYSTALLINE SILICON SEPARATION BY THERMOELASTIC STRAINS | 2011 |
|
RU2497643C2 |
| METHOD FOR CUTTING OF FRANGIBLE NON-METALLIC MATERIALS | 2002 |
|
RU2238918C2 |
| METHOD OF SPLITTING CRYSTALLINE QUARTZ UNDER EFFECT OF THERMOELASTIC STRESS | 2011 |
|
RU2478083C2 |
| METHOD OF BRITTLE MATERIALS CUTTING | 2015 |
|
RU2617482C1 |
