METHOD OF SOLDERING ELECTRONIC DEVICE ELEMENTS Russian patent published in 2010 - IPC B23K1/00 B23K1/20

Abstract RU 2405663 C1

FIELD: process engineering.

SUBSTANCE: invention can be used in soldering various electronic devices provided their surface features low factor of secondary emission of electrons. To limit creepage of melted solder over the surface of components, a coat is made by applying black chromium thereon. Gold- or, silver, or copper-based solder is applied onto soldered surfaces.

EFFECT: black chromium coat is not wetted by aforesaid solders to localise soldering area.

1 dwg

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RU 2 405 663 C1

Authors

Zakharov Aleksej Jur'Evich

Frejdovich Il'Ja Anatol'Evich

Barkova Nadezhda Pavlovna

Dates

2010-12-10—Published

2009-07-21—Filed