METHOD OF REFINING ORIENTATION OF WAFERS OF SEMICONDUCTOR AND OPTICAL MATERIALS Russian patent published in 2011 - IPC H01L21/302 

FIELD: physics.

SUBSTANCE: in the method of refining orientation of wafers of semiconductor and optical materials when cutting monocrystals into wafers using diamond wheels with an inner cutting edge of the rotary table, mounted on the spindle of the crystal rotary drive, assembling is performed with possibility of smooth rotation about the axis in two mutually-perpendicular directions with fixation, which enables cutting monocrystalline cylinders into wafers with accuracy of up to 1 angular minute.

EFFECT: easy smooth refining of the orientation of cut wafers with accuracy of up to 1 angular minute when cutting crystallographically aligned cylinders into wafers using diamond wheels with an inner cutting edge with rotation of the cylinders around their axis during cutting.

2 dwg, 1 ex