FIELD: manufacturing technology.
SUBSTANCE: provided is a polishing composition which can polish a sapphire substrate having non-polar plane or semi-polar plane at a high polishing rate. Invention provides a polishing composition used in an application to polish sapphire substrate having a non-polar plane or semi-polar plane, the polishing composition contains colloidal silica particles and water in which the value obtained by dividing the specific surface area (unit: m2/g) of the colloidal silica particles by a number-average particle diameter (unit: nm) of colloidal silica particles, that is, the specific surface area/number-average particle diameter is 0.5 or more and 3.0 or less.
EFFECT: polishing composition is represented with the help of which it is possible to polish the sapphire substrate.
7 cl, 1 tbl
| Title | Year | Author | Number | 
|---|---|---|---|
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                RU2414550C1 | 
| METHOD FOR MACHINING OF CYLINDRICAL SAPPHIRE PARTS, SAPPHIRE PLUNGER PAIR AND METERING PUMP BUILT THERE AROUND | 2012 | 
									
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                RU2449880C1 | 
Authors
Dates
2018-03-12—Published
2014-02-07—Filed