POLISHING COMPOSITION Russian patent published in 2018 - IPC H01L21/304 

Abstract RU 2646938 C2

FIELD: manufacturing technology.

SUBSTANCE: provided is a polishing composition which can polish a sapphire substrate having non-polar plane or semi-polar plane at a high polishing rate. Invention provides a polishing composition used in an application to polish sapphire substrate having a non-polar plane or semi-polar plane, the polishing composition contains colloidal silica particles and water in which the value obtained by dividing the specific surface area (unit: m2/g) of the colloidal silica particles by a number-average particle diameter (unit: nm) of colloidal silica particles, that is, the specific surface area/number-average particle diameter is 0.5 or more and 3.0 or less.

EFFECT: polishing composition is represented with the help of which it is possible to polish the sapphire substrate.

7 cl, 1 tbl

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RU 2 646 938 C2

Authors

Ito Dzun

Khotta Kadzutosi

Sugiyama Khiroyasu

Morinaga Khitosi

Dates

2018-03-12Published

2014-02-07Filed