FIELD: process engineering.
SUBSTANCE: invention relates to abrasive processing and may be used for grinding articles made from super hard and fragile materials with Mohs' hardness above 8: diamonds, leucosapphire, ceramics, hard jewelry stones, optical and microelectronics materials. Specific power Wbr of material brittle failure, specific power Wdis of dislocation motion start and specific power W of grinding are determined. Magnitude of the latter is kept between specific power of material brittle failure and specific power of dislocation motion start subject to: wdis < w < wdr. Specific power of grinding is determined from parametres of grinding tool and processed article, pressing force, dynamic factor of friction and time of contact between grinding tool and processed article. The latter is regulated by varying grinding parametres and using external physical fields.
EFFECT: higher efficiency and quality at nanosized level.
6 cl, 2 dwg, 1 tbl, 5 ex
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SU1027007A1 |
Authors
Dates
2011-05-20—Published
2009-12-07—Filed