FIELD: electricity.
SUBSTANCE: method involves installation of card with prepared surface into flexible cartridge having the possibility of performing spatial movements, which is turned with mounting downwards, submerged to certain depth into the tank with silicon compound for 30-40 seconds, turned to initial state, and heating is performed at 40-50°C till complete curing of compound. Compound used in coating formation method has the following composition, wt %: low-molecular silicon rubber M 60000-100000 - 100, polyethylenepolyamine (PEPA) - 2-4, aerosil 175 - 5-10, titanium dioxide - 20-30, ethyl silicate -40 - 3-7, polyalkylsiloxane - up to 10, stannum diethyldicaprylate - up to 3.
EFFECT: improving coating properties.
4 cl, 2 tbl, 5 ex
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Authors
Dates
2012-06-27—Published
2011-05-03—Filed