MONOLITHIC INTEGRATED CIRCUIT Russian patent published in 2024 - IPC H01L23/482 

FIELD: electronic equipment.

SUBSTANCE: invention can be used for surface mounting of microelectronic components. Monolithic integrated circuit (MIC) is made in form of semiconductor crystal with formed contact pads for subsequent installation, wherein on the front side of the chip there is a topology, grounding and signal leads of a monolithic integrated circuit for mounting on a board, on the back side of the crystal there is a solid metalized grounding screen, electric connection of which with topology and grounding leads of monolithic integrated circuit is performed using through metallized holes, on lateral sides of the chip there are samples of arbitrary shape in places of outputs for mounting, which open gap windows to grounding and signal outputs of the monolithic integrated circuit.

EFFECT: invention provides reducing labor costs for quality control of soldered electrical connections of contact pads of the chip and the board, reducing the cost of manufacturing microwave modules, implementation of non-inductive electric connection of MIC and contact pads of the board, increase of mechanical shear strength of the crystal.

1 cl, 2 dwg