MULTI-CHIP MODULE Russian patent published in 2012 - IPC H01L25/10 

FIELD: electricity.

SUBSTANCE: multi-chip module contains at least two packages of bodies with integrated circuits of operating and permanent memory, a switching card and a processor mounted on the base. Mounted on the base is a set of microplates and a cover forming together with the base a sealed body assembly. Respectively mounted on the inner surfaces of the cover and the base are the switching card and the processor connected to the body microplates by means of wire connections while on the outer surface of the base external outputs are arranged electrically connected to the cover and the microplates by means of the switching card and via through current-conducting channels.

EFFECT: multi-chip module structure allows to significantly expand the functional capabilities of the module, to ensure its repair capability.

2 cl, 2 dwg