MULTICHIP MODULE Russian patent published in 2012 - IPC H01L25/04 

FIELD: physics.

SUBSTANCE: multichip module is in form of a pile of chip holders, each having stacked metal-coated micro-boards, the bottom board being in form of a solid substrate, the middle and top being in form of frames on which are mounted an integrated circuit and contact pads which are electrically connected by wire connections between themselves and by microconductors of the metal coating of the micro-boards with external leads which are in form of channels formed by coaxial through-holes and lying in the periphery of the micro-boards. The substrate and the frame of the micro-boards in the chip holders are rectangular and oval shaped, respectively, and the channels lie on each side of the module with equal spacing on an arc such that the centres of the channels and contact pads of the micro-boards having the same index numbers are connected by wires of equal length.

EFFECT: use of the invention prevents undesirable concentration of heat in separate zones of the structure of the module, thereby ensuring reliable operation of integrated circuits and the article as a whole.

5 dwg