FIELD: process engineering.
SUBSTANCE: invention relates to producing composite micromechanical component including deep ion-beam etching, electrotyping and forming. Proposed method comprises the following steps. Making substrate including top and bottom silicon layers with interlayer of silicon oxide arranged there between, selective etching of, at least, one cavity in top layer to confine component silicon part pattern, and further etching of said cavity in interlayer. Besides, proposed method comprises growing metallic layer from one section of said cavity to make metallic part in component cross-section to isolate silicon part of micromechanical component from destructive mechanism strains and separated said component from substrate.
EFFECT: composite micromechanical components suitable for watch making.
32 cl, 12 dwg
