FIELD: process engineering.
SUBSTANCE: invention relates to production of die for fabrication of mechanical parts by electrotype. Proposed method comprises deposition of current conducting layer on top and bottom surfaces (20, 22) of substrate (21) made of silicon-based material. Said plate is secured to substrate (23) with the help of adhesive layer. One part (26) of conducting layer is removed from top surface of plate (21). Plate is etched unless conducting layer (22) is removed at bottom surface and at part of die (26) removed from conducting layer (22) at its top surface for making of at least one cavity (25) in the die.
EFFECT: higher precision of micromechanical parts with several levels and/or high pliability.
19 cl, 13 dwg
