FIELD: electricity.
SUBSTANCE: proposed circuit substrate has a substrate, above which there is an interconnection, an insulating film and an outer connecting contact lead arranged in series. The circuit substrate comprises an anisotropic conducting film, having conducting particles on the outer connecting contact lead; and the outer connecting contact lead is connected to the interconnection at least via one contact window formed in the insulating film, besides, length from one edge to the other edge, in case of top view, of the area formed with one or more contact windows, which are connected to a specific outer connecting contact lead, exceeds the diameter of each conducting particle. Besides, the interconnection has a wide part, which protrudes across relative to the direction of interconnection stretching in case of top view, at the same time the contact window is provided in the wide part.
EFFECT: development of a circuit substrate, which provides a narrower frame in display devices when suppressing failures of a connection between interconnections and outer connecting contact leads.
7 cl, 15 dwg
