FIELD: electrical engineering.
SUBSTANCE: super high frequency bipolar p-n-p transistor contains a collector region based on p+-type monocrystal silicon substrate, an epitaxial p-type silicon layer, a diffusion thin n-region, a diffusion p+-type emitter region and metal contacts to the active regions; implemented in the transistor is a p-n-p UHF transistor structure where the collector and the basic regions are made of gallium and arsenic compounds based on the collector p+ monocrystal substrate, the collector in-series epitaxial p+-p-p-type layers, the epitaxial i-layer with conductivity close to proper, n-type, n-type thin epitaxial layers of the basic region while the emitter region is made of an in-series heterophase epitaxial p-p+-type emitter based on aluminium, gallium and arsenic compounds.
EFFECT: sharp increase of operational voltages, operational currents and power output; increase of limit frequency, current-amplification factor and safe operation region in static and dynamic modes.
2 dwg
Title | Year | Author | Number |
---|---|---|---|
CRYSTAL OF A HIGH-VOLTAGE HYPERSPEED HIGH-CURRENT DIODE WITH A SCHOTTKY BARRIER AND P-N JUNCTIONS | 2022 |
|
RU2803409C1 |
METHOD OF MANUFACTURING SEMICONDUCTING DEVICES WITH NEAR-WALL <P-N>-TRANSITIONS | 1981 |
|
SU1072666A1 |
TRANSISTOR | 1995 |
|
RU2119696C1 |
PROCESS OF MANUFACTURE OF S H F BIPOLAR TRANSISTORS | 1981 |
|
SU1032936A1 |
TRANSISTOR | 1995 |
|
RU2143157C1 |
BIPOLAR PLANAR N-P-N TRANSISTOR MANUFACTURING PROCESS | 1996 |
|
RU2107972C1 |
METHOD FOR PRODUCING VERTICAL P-N-P TRANSISTOR AS PART OF INTEGRATED CIRCUIT | 1995 |
|
RU2106037C1 |
METHOD OF MANUFACTURING CILICIC N-P-N HF-TRANSISTOR STRUCTURE | 1985 |
|
SU1284415A1 |
INTEGRAL CIRCUIT | 1992 |
|
RU2078390C1 |
METHOD FOR PRODUCING BIPOLAR-TRANSISTOR INTEGRATED CIRCUITS | 1988 |
|
SU1538830A1 |
Authors
Dates
2013-06-20—Published
2010-03-03—Filed