FIELD: physics.
SUBSTANCE: microelectromechanical magnetic field sensor includes a silicon housing plate in which a symmetrical pendulum is made by microfabrication, the pendulum being suspended on an elastic suspension, at the free end of which a magnetically sensitive layer is deposited. According to the invention, the elastic suspension of the pendulum is in form of two crossed torsion bars that are rigidly connected on the axis of symmetry with the pendulum and with the silicon housing plate; the pendulum is made from conducting silicon; at the second end of the pendulum there is a nonmagnetic layer whose mass and the arm to the axis of oscillation are respectively equal to the mass and the arm of the magnetically sensitive layer; there is a first non-conducting plate with first and second conducting planar power processing electrodes made on one side of the plate; the plate is rigidly connected to the silicon housing plate and is directed by conducting electrodes towards the pendulum without magnetically sensitive and nonmagnetic layers; the first and second conducting planar electrodes are placed on different sides of the axis of symmetry of the pendulum; there is a second non-conducting plate with conducting planar electrodes of a capacitive angular displacement sensor, directed by conducting electrodes towards the magnetic and nonmagnetic layers; the total height of the conducting electrodes of the second plate is less than the total height of electrodes of the first plate by the total height of the magnetic and nonmagnetic layers; there is a microcontroller, the capacitive pulse-width modulation inputs of which are connected to the first and second conducting electrodes of the second plate; and the first and second conducting electrodes of the magnetically sensitive layer of the first plate are connected to registers of the non-inverting and inverting outputs of the microcontroller.
EFFECT: high accuracy of the microelectromechanical magnetic field sensor by eliminating the effect of inertial forces.
3 dwg
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Authors
Dates
2013-08-20—Published
2012-02-27—Filed