FIELD: process engineering.
SUBSTANCE: invention relates to production of composites for heat sinks of semiconductor devices, in particular, Al-SiC composite with metal coating. Proposed method comprises impregnation of SiC powder with the melt of aluminium or aluminium alloy and diffusion bonding of impregnated blank with aluminium foil arranged at least one side of said blank wherein SiC powder is used as heat removal base of porous blank, placing of aluminium foil on said blank before impregnation and combining diffusion bonding with impregnation. Porous blanks with aluminium foil can be assembled in package of two and more porous blanks. Porous blanks of said package are separated by metal plates with melting point higher than that of aluminium or aluminium alloy.
EFFECT: accelerated process cycle, higher process efficiency, lower costs.
5 cl, 1 tbl, 4 ex
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