HEAT SINK AND UNIT FOR FLAT BODIES, PROVIDING FOR COOLING AND ASSEMBLY Russian patent published in 2014 - IPC G12B15/02 H01L23/473 G06F1/20 H05K7/20 

FIELD: heating.

SUBSTANCE: invention relates to power electronics, more specifically, to up-to-date cooling of power electronics. The result is achieved by a heat sink (300), designed for direction cooling of at least one body (20) of an electronic device. The body of the electronic device has an upper contact surface (22) and a lower contact surface (24). The heat sink comprises a cooling element (310), made at least from one heat-conducting material. This cooling element limits inlet headers (12) of coolant and outlet headers (14) of coolant. Inlet and outlet headers are located with alternation. The cooling element additionally limits millichannels (16) made as capable of receiving coolant from inlet headers and supplying coolant to outlet headers. Millichannels, inlet and outlet headers are additionally made with capability of direct cooling of one of contact surfaces of the electronic device body, upper or lower on, due to direct contact with coolant, so that this heat sink is made as a whole.

EFFECT: improved thermal characteristics and layout of units of power converters, where devices in flat bodies are used.

10 cl, 8 dwg