FIELD: chemistry.
SUBSTANCE: invention can be used in chemical industry. The porous SiO2 xerogel includes pores having a pore size of 50 to 1000 nm and carbon content of less than 10%. The porous SiO2 xerogel has a density of less than 400 kg/m3, thermal conductivity at 800°C below 0.060 W/m·K, thermal conductivity at 400°C below 0.040 W/m·K, and thermal conductivity at 200°C below 0.030 W/m·K, modulus of elasticity equal to at least 5 MPa.
EFFECT: disclosed xerogel has good mechanical stability and can be used at temperatures higher than 300°C.
7 cl, 4 dwg, 4 ex
Authors
Dates
2014-10-10—Published
2010-11-19—Filed