FIELD: process engineering.
SUBSTANCE: this invention is used for connection of sealed cases of the device built around microelectromechanical systems (MEMS). This invention consists in main god stack of the first metal to be oxidised in air on the surface of both first and second plates. Then, ply of second metal is made on outer surface of every stack of first metal second metal fusion points being lower than that of first ply (note that second metal ply depth is selected to be sufficient for prevention of first metal ply outer surface oxidation). Second metal ply is brought in contact with second metal ply on second plate to make the area of joint. Pressure is applied to first and second plates at the temperature of joint area lower the second metal fusion point to initiate the bonding. Note here that pressure of bonding is selected to be sufficient for deformation of second metal plies in joint area.
EFFECT: possibility to make sealed case.
13 cl, 5 dwg
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Authors
Dates
2014-12-20—Published
2010-03-02—Filed