METHOD FOR SEALING MEMS DEVICES Russian patent published in 2024 - IPC B81C1/00 

FIELD: sealing MEMS devices.

SUBSTANCE: essence of the invention lies in the fact that the method of sealing MEMS devices includes the formation of grooves, the formation of connecting bus bars and container linings, the formation of a vacuum atmosphere, bringing the base and sealing cap into contact. To form grooves in the base, a thinning process is used, the grooves are filled with a barrier layer and metal by atomic layer deposition of the material. The connecting bus bars are removed from the sealing working area through the reverse side of the base, recesses and a working cavity are formed in the base by plasma-chemical etching, protrusions and a getter area are formed on the sealing cover, while the protrusions of the sealing cover and the recesses of the base are connected by certain relations, also the shapes of the protrusions and the shapes of the recesses coincide and are made in the form of closed contours along the peripheries of the working areas. The process of separating MEMS devices is carried out by perforation, the vacuum level inside the sealing working area is measured by the deflection of the membrane.

EFFECT: providing the ability to increase the reliability of MEMS devices by improving their tightness.

1 cl, 7 dwg