FIELD: chemistry.
SUBSTANCE: invention relates to application of conformal coating on electronic device and comprises the steps that follow. (A) Heating of conformal coating bond including parylene bond of conformal coating for components sensitive to moisture for formation of gaseous monomer of conformal coating compound. (B) Integration of boron nitride with gaseous monomers. (C) Brining the electronic device surface in contact with gaseous monomers and boron nitride at conditions whereat conformal coating is formed on, at least a part of the surface including the compound of conformal coating and nitride boron to add water resistance to said surface.
EFFECT: expanded applications.
7 cl, 3 dwg, 1 tbl
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