FIELD: process engineering.
SUBSTANCE: organic material is fed to deposit LED component gas or polymer-forming process gas along with carried gas by gas inlet 3 into precipitation chamber 8 to deposit thin layer LED components on those of polymer pm surface 7' of substrate 7 located at on substrate holder bearing surface 4' opposite gas inlet 3. Prior to feeding said components into precipitation chamber 8, gas inlet 3 or substrate holder surface 4 is thermally controlled so that holder substrate bearing surface temperature 4 (TS) is lower than gas inlet temperature (TG). Temperature of substrate 7 is stabilised at pressure P1 exceeding 100 Pa in precipitation chamber 8 by deriving heat to holder 4 to substrate temperature TD exceeding substrate holder bearing surface temperature TS but lower than gas inlet temperature TG. Then precipitation chamber pressure P1 is decreased to working pressure P2. Working pressure P2 reached, organic material is fed into said precipitation chamber to deposit LED components carried by gas carrier.
EFFECT: coat application at substrate temperature exceeding that of substrate holder support surface.
16 cl, 2 dwg, 1 ex
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Authors
Dates
2013-12-27—Published
2009-05-14—Filed