FIELD: heating.
SUBSTANCE: semiconductor device, namely a light-emitting-diode illuminating device includes substrate (2), variety of light-emitting diodes (4) located on the front side of the substrate. In the substrate there is a variety of openings (9), in which heat-conducting elements in the form of tubular elements or tubes (1) are located. Heat-conducting elements in the form of platforms (10) are located between light-emitting diodes and tubes. Each tube forms an open passage without any obstacles through openings between the front side and the rear side of the substrate. Heat radiated in light-emitting diodes is transmitted in a conducted manner to tubes from where it is dissipated by means of convection.
EFFECT: possibility of cooling light-emitting diodes without using any heat sinks usually located on the rear side of a printed circuit board and without any need for use of forced air cooling.
13 cl, 3 dwg
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