FIELD: heating.
SUBSTANCE: semiconductor device, namely a light-emitting-diode illuminating device includes substrate (2), variety of light-emitting diodes (4) located on the front side of the substrate. In the substrate there is a variety of openings (9), in which heat-conducting elements in the form of tubular elements or tubes (1) are located. Heat-conducting elements in the form of platforms (10) are located between light-emitting diodes and tubes. Each tube forms an open passage without any obstacles through openings between the front side and the rear side of the substrate. Heat radiated in light-emitting diodes is transmitted in a conducted manner to tubes from where it is dissipated by means of convection.
EFFECT: possibility of cooling light-emitting diodes without using any heat sinks usually located on the rear side of a printed circuit board and without any need for use of forced air cooling.
13 cl, 3 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| LIGHTING DEVICE WITH EMITTING DIODE RADIATOR REFLECTOR | 2021 |
|
RU2773008C1 |
| HIGH-DENSITY LED MODULE WITH HYBRID COOLING | 2023 |
|
RU2822102C1 |
| DEVICE FOR HEAT REMOVAL FROM FUEL COMPONENTS | 2015 |
|
RU2586620C1 |
| DEVICE TO REMOVE HEAT FROM HEAT RELEASING COMPONENTS | 2013 |
|
RU2546963C1 |
| LED LAMP WITH CYLINDRICAL LIGHT GUIDE | 2018 |
|
RU2706047C1 |
| LED MODULE/LINE/AMD LAMP BASED THEREON | 2012 |
|
RU2488739C1 |
| LED LAMP | 2023 |
|
RU2823545C1 |
| DEVICE THAT HAS SUBSTRATE FOR HIGH-POWER COMPONENTS OF ELECTRIC CIRCUIT AND HEAT SINK, AS WELL AS METHOD FOR MANUFACTURING SUCH DEVICE | 1998 |
|
RU2201659C2 |
| LED LAMP WITH CONVECTION COOLING | 2021 |
|
RU2768510C1 |
| LED MODULE AND LAMP CONTAINING SAID MODULE | 2013 |
|
RU2612563C2 |
