FIELD: physics, optics.
SUBSTANCE: device comprises semiconductor structure with light-emitting ply, luminescent material located on the path of light emitted by light emitting ply and thermal-contact material arranged in translucent material. Note here that thermal-contact material does not convert light-emitting ply light wavelength. Thermal-contact material features higher heat conductivity than that of translucent material. Thermal-contact material is located to dissipate heat from luminescence material. Thermal-contact material features the particle median size larger than 10 mcm. Thermal-contact material refraction ratio differs from that of translucent material by less than 10%.
EFFECT: ruled out undesirable shift of colour hue and reduction in light output.
20 cl, 6 dwg
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