COMPUTER UNIT Russian patent published in 2015 - IPC G12B9/00 H02B1/32 H02B1/36 H05K7/14 H05K7/18 

FIELD: physics, computer engineering.

SUBSTANCE: invention can be used in a railway automation system equipment having high requirements for moisture and dust protection. The computer unit includes functional cells in the form of printed-circuit boards with electronic components mounted on guides and connected by electrical connectors at their ends with a motherboard and protected by a casing. The casing consists of side walls, front and rear frames which form a chassis, to which a cover, a base and front and rear panels are mounted. On the inner side of the side walls there are stiffening ribs, along the upper edges of which there are grooves; at the ends there are openings for mounting the front and rear frames, and their sides adjoin protrusions to which rails are mounted, and guides are mounted perpendicularly. Around the inner periphery of the front and rear frames there are mating surfaces, on the outer side of which there are grooves under elastic spacers, on the corners of the opening for mounting side walls to the stiffening ribs, and on the inner side along the upper and lower edges there are horizontal protrusions which form grooves which, when assembling the chassis, form a closed loop of grooves on its upper and lower surfaces under elastic spacers. The functional cells are inserted into the chassis and are attached by one end to the mating surface of the front frame, and by the other end to the motherboard, which is mounted across the chassis and is mounted to the rear rails. Functional cells with high heat dissipation are fitted with heatsinks. The front panel has radiators and functional cells with heatsinks are mounted under the radiators. On the inner side of the front panel around openings for connectors there are grooves for elastic spacers.

EFFECT: high reliability of protecting the unit from electromagnetic radiation, external vibrations, moisture and dust penetration and providing effective heat removal from electronic components with high heat dissipation.

3 cl, 4 dwg