FIELD: physics.
SUBSTANCE: first, masks of absorbing material are applied on substrate surface at the points of recesses or holed thereon. Then, substrate is irradiated with the train of laser nano- and subnanosecond-long pulses, pulse length being smaller than the time of substrate heating wavelength by half the spacing between adjacent masks. Temperature at locations of said masks is brought to the substrate material sublimation level.
EFFECT: laser micro processing and profiling or drilling of plates and diamonds and other translucent dielectrics.
4 cl, 1 dwg
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