METHOD OF ASSEMBLING PIXELATED LARGE-FORMAT PHOTODETECTOR MODULE FROM PHOTODETECTOR MODULES OF SMALLER AREA Russian patent published in 2015 - IPC H01L21/98 

FIELD: physics.

SUBSTANCE: during assembly, photodetector modules of smaller area are split into groups. Photodetector modules of each group are placed in a row to form parallel rows. Photodetector modules of smaller area with a reading circuit, made from one material which is characterised by one coefficient of thermal expansion, and a photodetector chip with photosensitive cells based on another material which is characterised by another coefficient of thermal expansion, are rigidly mounted on a common base. Mounting is carried out without connecting the photodetector module with the common base with respect to the region of the photodetector module in which photosensitive cells connected to the reading circuit are located using a holder. During mounting, the photodetector module in the part having said region is suspended on the holder relative to the common base to form, between the base and the photodetector module, space which enables to bend the photodetector module without contact with the base under the effect of mechanical stress arising from thermal cycling.

EFFECT: preventing image degradation with increase in thermal cycles, increase in the number of thermal cycles in the operating period.

5 cl, 3 dwg, 3 ex