FIELD: physics.
SUBSTANCE: invention relates to physics of low-dimensional structures namely to a method of producing quasi monocrystalline intermetallic thin film of nano-sized structure, and can be used in different high-tech fields of industry and science for creating nano structured materials. On the glass substrate in vacuum at residual pressure of at least 10-5 torr copper and tin films are applied with layer thickness of 30-60 nm - up to six layers in total in sequence Cu/Sn/Cu/Sn/Cu/Sn and the chemical reaction between layers is conducted by relaxation annealing with moderate rate of 1 deg/s from room temperature to 600 °C in vacuum at residual pressure of at least 10-5 torr to obtain a column oriented structure in the film.
EFFECT: invention is aimed at obtaining crystallographically aligned quasi monocrystalline intermetallic thin films of Cu6Sn5.
1 cl, 9 dwg, 2 tbl, 5 ex
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Authors
Dates
2016-09-20—Published
2015-04-23—Filed