THIN NANOCRYSTALLINE INTER-METALLIC FILM ON GLASS SUBSTRATE PRODUCTION METHOD Russian patent published in 2019 - IPC C30B23/02 C30B23/06 C30B29/10 C23C14/14 C23C14/18 C23C14/24 C23C14/54 C23C14/58 B82B3/00 B82Y30/00 B82Y40/00 

Abstract RU 2680072 C1

FIELD: physics.

SUBSTANCE: invention relates to the field of the low-dimensional structures physics, namely to the nanoscale thin-film structure formation, and can be used in various industry and science high-tech fields for the new materials development. Thin nanocrystalline intermetallic film on the glass substrate production method includes the metal layers condensation in vacuum and performance of the intermetallic compound synthesis, so that copper and tin layers are applied on the heated glass substrate in the Cu/Sn sequence in the temperatures range of 50–400 °C, and the substrate temperature is determined from the Cu6Sn5 and Cu3Sn intermetallic phases in the film required content.

EFFECT: technical result consists in the Cu-Sn binary system in the form of intermetallic phase islands thin films obtaining with the Cu6Sn5 and Cu3Sn intermetallic phases concentrations adjustable ratio, having the characteristic physical and mechanical properties.

1 cl, 10 dwg, 5 tbl, 5 ex

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RU 2 680 072 C1

Authors

Makrushina Anna Nikolaevna

Plotnikov Vladimir Aleksandrovich

Makarov Sergej Viktorovich

Dates

2019-02-14Published

2017-12-27Filed