FIELD: electricity.
SUBSTANCE: invention relates to deformable device and corresponding method of making for use in electronic device. In proposed device comprising deformable substrate (3); conductive part (7) and at least one support (5), configured for connection of conducting part (7) with deformable substrate (3), elements are configured so that said conducting part (7) is separated from deformable substrate (3) by gap.
EFFECT: configuration of electronic components and connections between components so, that they are not damaged at deformation of device in response to force applied by user.
47 cl, 37 dwg
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