METHOD OF DIGITAL INTEGRATED CIRCUITS TRANSIENT THERMAL CHARACTERISTICS MEASURING Russian patent published in 2017 - IPC G01R31/28 

FIELD: heat engineering.

SUBSTANCE: invention can be used for control of digital integrated circuits thermal properties. Summary of invention consists in fact, that method consists in digital integrated circuit heating with stepped electric heating power of known value and in measurement at certain moments in time during digital integrated circuit heating of heat-sensitive parameter with known temperature coefficient, according to change of which digital integrated circuit active area temperature increment is calculated, in order to simplify method and reduce transient thermal characteristics measurement error for electric heating power setting odd number (n>1) of controlled digital integrated circuit logic elements are connected according to ring oscillator scheme, connecting it to power supply source, at given moments in time t_i measuring instantaneous power, consumed by digital integrated circuit from power supply source, and ring oscillator oscillations frequency, and value of transient thermal characteristics at moment of time t is defined by formula: where ƒ_kg(0) and ƒ_kg(t_i) is ring oscillator oscillations frequency at moments of time t₀=0 and t_i, respectively, K_ƒ is ring oscillator oscillations frequency temperature coefficient, P_av(t_i)=[P(0)+P(t_i)]/2 is average power, consumed by digital integrated circuit during time from beginning of heating t₀=0 to moment of time t_i, and P(0) and P(t_i) are instantaneous power, consumed by digital integrated circuit at moments of time t₀= 0 and t_i, respectively.

EFFECT: technical result is enabling possibilities to simplify method and reduce error of digital integrated circuits thermal transient characteristic measuring.

1 cl, 2 dwg