METHOD OF DETERMINING THERMAL RESISTANCE OF DIGITAL INTEGRAL MICROCIRCUITS Russian patent published in 2021 - IPC G01R31/28 

FIELD: measurement.

SUBSTANCE: invention relates to measurement equipment and can be used for quality control of digital integrated microchips with CMOS logic elements and evaluation of their temperature reserves. Essence: one or more logic elements of the controlled microcircuit chip are heated by supplying to their inputs switching pulses of high frequency F_HF. Input of logic element selected as temperature sensor and having no functional connection to heating logic elements, rectangular switching pulses are sent, the repetition frequency F_NTC for which is less than the switching frequency F_HF of heating logic elements. Pulses from the output of a logic element selected as a temperature sensor are supplied to the input of a constant voltage voltmeter through in-series connected two external in relation to the controlled microchip CMOS inverter. Prior to and after heating, mean value of pulse voltage and heating power are measured and their increments are determined. Mean value of pulse voltage is used as temperature-sensitive parameter. Thermal resistance is defined as ratio of increment of average value of pulse voltage to increment of heating power and known temperature coefficient of average value of pulse voltage.

EFFECT: technical result is reduction of measurement error due to exclusion of influence of electrical component in power circuit of controlled microcircuit.

1 cl, 2 dwg