METHOD FOR MEASURING TRANSIENT THERMAL CHARACTERISTICS OF DIGITAL INTEGRATED CIRCUITS Russian patent published in 2019 - IPC G01R31/28 

FIELD: measuring equipment.

SUBSTANCE: invention relates to measurement equipment and can be used for control of thermal properties of digital integrated circuits (DIC). Essence: for measurement of transient thermal characteristic (TTC) of a digital integrated circuit, an odd number of logic elements include a circuit of a ring generator. Supply voltage of the preset value is supplied and the digital integral circuit is warmed up with a step of electric heating power. One logical element of the digital integrated circuit is maintained in a given logic state, and the temperature-sensitive parameter is the voltage at the output of the logic element whose state is given. Measured during heating at given time t_i instantaneous consumed power and voltage at output of logic element with known temperature coefficient of voltage. Calculating average power consumption of digital integrated circuit for time from heating start t₀=0 until moment of time t_i. Determining the transient thermal characteristic value as the ratio of voltage increment at the output of the logic element to the known temperature coefficient and to the average consumed power for each given time moment t_i by formula

,

where U_out(0) and U_out(t_i) is output voltage of logic element, logical state of which is set, at moments of time t₀=0 and t_i respectively, K_U – temperature coefficient of output voltage of logic element, P_cp(t_i)=[P(0)+P(t_i)]/2 – average power consumed by digital integrated circuit in time from heating start to time moment t_i, and P(0) and P(t_i) is instantaneous power consumed by digital integrated circuit at moments of time t₀=0 and t_i respectively.

EFFECT: high accuracy of measuring TTC at the beginning of heating of the DIC.

1 cl, 2 dwg