FIELD: physics.
SUBSTANCE: pulses of ultrasonic vibrations are radiated from one side of the controlled object, the first through and the twice reflected pulses are received from the opposite side of the products, and the echo pulses of the ultrasonic oscillations reflected from the defect scan the product over the entire area, ensuring alignment of the emitting and receiving ultrasonic transducers, the envelopes of the amplitudes of the ultrasonic vibrations of the first of the last (through) pulse and echo signals from defects in the time interval between the first and the second through pulses are analyzed, additionally, the coordinates of the reduction product are read that passed the through pulses, the sensitivity of the signal reception is increased in the time interval between the first and the second through pulses, the time interval between the first through pulse and the first echo signal from the defect are measured, according to the measured values the location and depth of the defect are determined.
EFFECT: increasing the reliability of ultrasonic inspection of products.
5 dwg
