METHOD FOR MEASURING MECHANICAL STRESSES IN MEMS-BASED STRUCTURES Russian patent published in 2017 - IPC H01L21/66 

FIELD: measuring equipment.

SUBSTANCE: method for measuring mechanical stresses in MEMS-based structures includes forming an intermediate layer between a coating film and a base, wherein the intermediate layer can have an arbitrary thickness, the relative elongation of the coating film is measured by changing the gap width between the edge of the beam and the periphery of the coating film by means of a scanning electronic microscope and the mechanical stresses on the working plates are calculated according to the formula , where L is the length of the loose end of the beam after elongation/compression, d₀ is a gap between the edge of the beam and the periphery of the coating film before etching the intermediate layer, d is a gap between the edge of the beam and the periphery of the coating film after etching the intermediate layer, is Young's modulus of the coating, is Poisson's ratio of the coating.

EFFECT: providing the possibility of improving the measurement accuracy.

2 dwg