MANUFACTURE METHOD OF THIN-FILM CHIP RESISTORS Russian patent published in 2017 - IPC H01C17/75 

FIELD: electricity.

SUBSTANCE: manufacture method includes the windows etching in the workpiece dielectric layer from the lacquer foil dielectric up to the copper foil layer, the galvanic copper depositing in these windows, vacuum deposition of the resistive and conductor layers on the dielectric layer of the substrate, forming the resistive elements and contact pads for them in the windows area in the workpiece dielectric layer, which are the multi-layer structure from the copper foil, the galvanic and vacuum copper, inside which the electrical contact is made of conductive and resistive layers along the entire perimeter.

EFFECT: increase of the resistors reliability due to increasing the maximum possible contacting surface of the conductive and resistive layers along its perimeter in the area of the resistors contact pads and location of the resistors contact pads on both substrate surfaces.

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