VIAS SELECTIVE DIVISION IN PRINTED CIRCUIT BOARDS Russian patent published in 2017 - IPC H05K3/42 H05K3/46 

FIELD: printing industry.

SUBSTANCE: method contains the step, preceding the hole drilling for the via (240), consisting in laminating of the printed circuit board (200) to form the first and the second resisable to metallization layers (233, 234) at such distance from each other, that corresponds to the predetermined length of the via electrical insulating section. After drilling, the copper is applied into the certain areas of the via (240) inner surface in two different process steps, followed by the step of the copper removing from unnecessary sections to form the electrical insulating section.

EFFECT: creation of non-conducting sections of different sizes in the via, using the resistable to metallization layers of the same type and thickness, which simplifies the production process, eliminates the necessity to have the stock of resistable to metallization layers of different thickness, and provides more flexible design of the circuits.

8 cl, 8 dwg