EXTENSION OF TERMINAL PADS TO EDGE OF CHIP WITH ELECTRICAL INSULATION Russian patent published in 2014 - IPC H01L33/38 

FIELD: physics, optics.

SUBSTANCE: LED chips are made by forming LED layers, including a first conductivity type layer, a light-emitting layer and a second conductivity type layer. Channels are formed in the LED layers, which at least partially penetrate the first conductivity type layer. Electrical insulation regions are formed on or adjacent to at least portions of the first conductivity type layer along the edges of the chip. The first conductivity type terminal pad layer is formed to be in electrical contact with the first conductivity type layer and extends over separating tracks between the LED chips. The second conductivity type terminal pad layer is formed to be in electrical contact with the second conductivity type layer and extends over separating tracks between the LED chips and electrically insulated portions of first conductivity type layer. LED chips are mounted on chip holders and LED chips are separated along separating tracks between LED chips.

EFFECT: invention simplifies the apparatus and lowers the cost.

15 cl, 14 dwg