FIELD: physics.
SUBSTANCE: pretersonic module contains piezoelectric-crystal plate and sealing cover. The sealing cover is executed from this material and has the same or smaller linear dimensions in the plan, as a piezoelectric-crystal plate. The continuous dielectric framework having metallisation outside with a backlash concerning contact platforms is located between the piezoelectric-crystal plate and the sealing cover out of working field pretersonic device. Terminators in the form of thickenings are generated on the sealing cover and the piezoelectric-crystal plate. All interface electronic devices are executed on the piezoelectric-crystal plate. The piezoelectric-crystal plate and the sealing cover have metallisation with outside and lateral faces with backlash concerning contact platforms. The sealing cover has metallisation from the inside with backlash concerning contact platforms. The piezoelectric-crystal plate from the inside has metallisation outside of working field of the pretersonic device, interface devices and contact platforms. The contact platforms are executed on lateral and outside surfaces of the piezoelectric-crystal plate, a sealing cover and on lateral aspect of the dielectric framework.
EFFECT: reduction of overall dimensions.
10 cl, 2 dwg
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Authors
Dates
2009-04-10—Published
2007-06-18—Filed