FIELD: electricity.
SUBSTANCE: electroconductive solids are transferred to a region of a predetermined shape on the surface of the substrate. The electroconductive solids are heated to a temperature higher than the characteristic melting point of the electrically conductive solids, to form a melt. The melt is pressed against the substrate in the gap. The surface temperature of that portion of the gap that contacts the melt is below the characteristic melting point.
EFFECT: proposal of a method of producing conductive circuits characterized by good adhesion, high peel strength, high conductivity continuity on the substrate.
19 cl, 12 dwg
