FIELD: instrument engineering.
SUBSTANCE: invention relates to instrument-making and can be used in making silicon resilient elements of micromechanical sensors, such as pressure, acceleration and angular velocity sensors. In the method of forming shaped silicon structures, which consists in forming a relief by alternating anisotropic and isotropic methods of etching a silicon structure, after anisotropic and isotropic etching, a thin layer is removed by thermal oxidation and removal of silicon oxide from the obtained relief.
EFFECT: invention increases quality factor of micromechanical elastic elements by forming a relief with a surface structure maximally close to ideal crystalline surface with no defects of its surface.
1 cl, 4 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD OF MICRO-PROFILING OF SILICON STRUCTURES | 2014 |
|
RU2559336C1 |
| METHOD OF MANUFACTURE OF ELASTIC ELEMENTS OF MICROMECHANICAL SENSORS | 2016 |
|
RU2648287C1 |
| METHOD FOR MANUFACTURING OF INTEGRAL CONVERTERS | 2018 |
|
RU2698486C1 |
| METHOD OF FORMING DEEPLY PROFILED SILICON STRUCTURES | 2018 |
|
RU2691162C1 |
| METHOD OF PRODUCING RELIEF IN DIELECTRIC SUBSTRATE | 2018 |
|
RU2687299C1 |
| METHOD TO MANUFACTURE MICROMECHANICAL VIBRATION GYROSCOPE | 2011 |
|
RU2485620C1 |
| METHOD TO MANUFACTURE NANOSIZED WIRE SILICON STRUCTURES | 2010 |
|
RU2435730C1 |
| METHOD FOR MANUFACTURING ELASTIC ELEMENTS FROM SINGLE-CRYSTAL SILICON | 2021 |
|
RU2770165C1 |
| METHOD OF MANUFACTURING INTEGRAL SILICON MECHANICAL-ELECTRICAL CONVERTERS | 1979 |
|
SU807917A1 |
| METHOD FOR FORMING BULK SILICON ELEMENTS FOR MICROSYSTEM TECHNOLOGY DEVICES AND A PRODUCTION LINE FOR IMPLEMENTING THE METHOD | 2022 |
|
RU2794560C1 |
