SOLDER FOR ALUMINUM ALLOY SOLDERING AND METHOD FOR PRODUCTION THEREOF Russian patent published in 2007 - IPC B23K35/28 C22C21/02 B23K35/40 

Abstract RU 2297907 C1

FIELD: metallurgy, in particular solder for connection of heat hardenable aluminum alloys.

SUBSTANCE: claimed solder contains (mass %): silicon 4-12; germanium 4.6-25; strontium 0.003-0.01; cerium 0.05-0.15; and balance: aluminum. Additionally solder may contain 0.3-1.0 mass % of magnesium. Solder is obtained by ingot production, diffusion annealing at temperature being by 5-10°C higher than solidus temperature for 5-24 h and further cogging.

EFFECT: solder of decreased melting point; brazed constructions of increased strength.

4 cl, 1 ex

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RU 2 297 907 C1

Authors

Konkevich Valentin Jur'Evich

Stepanov Vladimir Valer'Evich

Suslov Aleksandr Aleksandrovich

Kurguzov Nikolaj Vasil'Evich

Frolov Vadim Anatol'Evich

Pimenov Jurij Petrovich

Belotserkovets Viktor Vladimirovich

Dates

2007-04-27Published

2005-08-18Filed