FIELD: metallurgy, in particular solder for connection of heat hardenable aluminum alloys.
SUBSTANCE: claimed solder contains (mass %): silicon 4-12; germanium 4.6-25; strontium 0.003-0.01; cerium 0.05-0.15; and balance: aluminum. Additionally solder may contain 0.3-1.0 mass % of magnesium. Solder is obtained by ingot production, diffusion annealing at temperature being by 5-10°C higher than solidus temperature for 5-24 h and further cogging.
EFFECT: solder of decreased melting point; brazed constructions of increased strength.
4 cl, 1 ex
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Authors
Dates
2007-04-27—Published
2005-08-18—Filed