METHOD OF CHANGING PLATE SURFACE CURVATURE RADIUS FOR MINIMIZING MECHANICAL STRESSES Russian patent published in 2018 - IPC H01L21/02 

FIELD: technological processes.

SUBSTANCE: essence of the present invention is that the curvature of the surface of the plate is changed by depositing the film layer on the plate, using various gas mixtures, deposition is carried out with the subsequent etching of the film layer, the magnitude of the mechanical stresses across the plate in the local regions is calculated according to Stoney formula, the value of mechanical stresses is compared with the σ_k mechanical stress reference value for the success of the subsequent technological operation, for |σ|<|σ_k| carry out the operation, for |σ|>|σ_k| precipitate or etch the film repeatedly.

EFFECT: it is an object of the present invention to broaden the methods for changing the curvature of a surface by expanding the methods for producing the films used, the types of films used, and the possibility of varying the thickness of the films.

1 cl, 3 dwg