METHOD OF INTEGRATED SCHEME INTEGRATION BY FLIP CHIP METHOD Russian patent published in 2018 - IPC G06K19/77 

FIELD: computer equipment.

SUBSTANCE: invention relates to the field of computing devices. Technical result is achieved by flip chip, a contact pad disposed with an offset relative to the flip chip, an interconnection electrically connecting the contact pad to the flip chip, the interconnection and the contact pad being formed on the flexible film, while providing the core of the carrier, in which a flexible film having a plurality of interconnection patterns is placed between the first substrate and the second substrate, further includes a step, on which the contact pad is opened through the cavity in the second substrate and the core of the carrier is laminated to create a multilayer support core, in which the contacting surface protrudes through the cavity in the second substrate to form a continuous, even surface from the outer surface of the multilayer support core to the contacting pad, so that the area between the pad and the outer surface of the multilayer support core does not have a gap.

EFFECT: technical result consists in expanding the arsenal of technical means for manufacturing an intellectual map.

23 cl, 24 dwg