FIELD: physics.
SUBSTANCE: invention relates to integrated circuit modules, smart card, tape carrier and methods of their manufacture. Embodiments of the invention provide an integrated circuit (IC) chip module having contact pads which are accessible by single attachment holes and antenna contact pads on the side of the module, which are accessible through multiple attachment holes. Each hole of multiple attachment is separated by sealing to adjoining attachment channels for separate reception of wire connection(s) and antenna connection element. Each contact platform of the antenna on the side of the module is separated by sealing to adjoining, but electrically connected attachment zones, in order to enable the electrical connection of both of the wire connection(s) and the antenna connection element with the IC chip. First and second attachment zones are separated from each other by means of a sealant without necessity of presence of a substrate between them.
EFFECT: technical result is reduction of number of steps when manufacturing an intelligent card, high reliability of electrical connections.
51 cl, 38 dwg
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