FIELD: electrical engineering.
SUBSTANCE: invention relates to the field of electrical engineering and can be used during development of materials with magnetic properties, subjected to the complex machining in the cured state. Highly filled epoxy-ferrite molding compound contains epoxy diane resin, inert plasticizer, ferrite filler, amine type PEPA hardener. As the inert plasticizer, the compound contains an active diluent, butyl cellosolve Laproxide 301B monoglycidyl ether. Epoxy-ferrite compound components ratio is as follows, pts. wt.: epoxy resin ED-22 100, ferrite filler 500–600, amine type hardener PEPA 24, butyl cellosolve Laproxide 301B monoglycidyl ether 20.
EFFECT: invention allows to produce the plastic compound with uniformly dispersed disperse filler without additional use of the solvent, to improve the cured material performance properties.
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Authors
Dates
2019-03-01—Published
2017-12-18—Filed