TRANSPARENT MATERIAL CUTTING WITH ULTRA-FAST LASER AND BEAM FOCUSING SYSTEM Russian patent published in 2018 - IPC B23K26/38 C03B33/02 

FIELD: technological processes.

SUBSTANCE: invention relates to a method for laser drilling of material and system therefor. System includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm. Wavelength is selected such that the material is substantially transparent at this wavelength. System further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly. Method includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction, the laser beam focal line has a length extending along the direction of propagation of the beam, which is in the range from 0.1 mm to 100 mm, and an average spot diameter, which is in the range from 0.1 mcm to 5 mcm. Laser beam focal causes induced absorption inside the material, producing a line of defects having a diameter less than or equal to 300 nm, along the laser beam focal line inside the material. Pulsed laser has a laser power of 10 W to 150 W and provides a burst of pulses with at least 2 pulses per burst of pulses.

EFFECT: disclosed are cutting of transparent materials with an ultra-high-speed laser and a beam focusing system.

47 cl, 14 dwg, 4 tbl