FIELD: nanotechnologies.
SUBSTANCE: use: to form dielectric films of nanometer thickness on the surface of semiconductors AIIIBV. Essence of the invention consists in the fact, that the method for producing nanoscale dielectric films on the surface of GaAs using a magnetronically formed manganese dioxide layer comprises pre-treating GaAs plates with concentrated hydrofluoric acid, washing them with distilled water, drying in air, forming a layer of MnO2 with thickness of 30 ± 1 nm, subsequent thermo-oxidation at a temperature of 450 to 550 °C for 60 minutes at an oxygen flow rate of 30 L/h, according to the invention, MnO2 layer are formed by magnetron sputtering of a target in argon atmosphere pAr ~ 10-3 Torr.
EFFECT: technical result is the possibility of forming nanoscale structured dielectric films on the surface of GaAs with an average elevation difference of not more than 25 nm, thickness in the range from 75 to 200 nm, specific resistance of ~1010 Ohm * cm and dielectric strength of ~7×106 V/cm.
1 cl, 4 dwg
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Authors
Dates
2019-01-16—Published
2017-03-06—Filed