FIELD: technological processes.
SUBSTANCE: invention relates to methods for processing substrates. Methods include the step of ensuring the flow of a water-containing liquid medium through the flow channel and at least one discharge slot on the substrate to be processed, as well as irradiation of the water-containing liquid medium with ultraviolet radiation with a given wavelength at least in the section of the flow channel directly adjacent to at least one outlet slit, and after passing the water-containing liquid medium through the outlet opening in the direction of the substrate and, thus, before applying and during application of the water-containing liquid medium on the surface of the substrate to be treated. In one method, the electrical conductivity of a water-containing liquid medium is adjusted so that it is in the range of 20 to 2,000 mcS, by adding additives to the water-containing liquid medium, prior to the addition of additives, the electrical conductivity of the water-containing liquid medium is less than 20 mcS, before irradiation or during irradiation of the medium with ultraviolet radiation. In addition, the pH value of the water-containing liquid medium can be adjusted to a range from 8 to 11 or from 3 to 6 before irradiation or during irradiation of the medium with ultraviolet radiation.
EFFECT: these adjustments can lead to a shift in the equilibrium position of the active particles created in a water-containing liquid medium using ultraviolet radiation in the direction of creating preferred particles.
24 cl, 8 dwg
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Authors
Dates
2019-02-15—Published
2016-09-20—Filed