FIELD: physics.
SUBSTANCE: invention relates to solid-state infrared sensors, and more particularly to uncooled infrared thermocouple sensors. Thermocouple sensor comprises an infrared-absorbing layer on a dielectric membrane mounted relative to the substrate on thermally insulating microconsoles, one end of which is fixed to the membrane and the other end - on the substrate. At least one thermocouple is formed on the surface of the consoles, the “hot junction” of which is located on the membrane, which is heated by the action of infrared radiation, increasing the temperature of the “hot junction”, and the “cold” contacts are located on the substrate having a stable temperature. Optimal ratio between the length of the consoles and the sensor area, defined in the present invention, allows the sensor to achieve the minimum value of the noise-equivalent temperature difference and, respectively, the maximum signal-to-noise ratio for a given sensor area and frame time.
EFFECT: highest possible sensitivity of the thermocouple sensor is achieved.
1 cl, 3 dwg
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Authors
Dates
2019-03-05—Published
2017-12-27—Filed